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- Strange problem
Re: Strange problem
It is Biostar, labled Biostar, anyway. Don't know if Chips oem them for
Biostar. Everest says it's a Biostar, and they're pretty good at
identifying the original maker. Forex, I've got an ECS labled Abit
manufactured mb, Everest called it an Abit board, and Abit has the identical
board on their product list.
No, but it's been on sale since 2004, so I _asssume_ that the rev board I
bought new in Dec 2005 from Newegg is latest production model and _should_
have most bugs ironed out.
Checked with my old dmm, voltages look ok. Newest bios is from Sept 2005,
that's the one I had to load when I first installed the board to use the A64
version I had. Gave the chipset heatsink the finger test, didn't stick, so
it's not _too_ hot. Didn't pull the heatsink, don't want to pull the mb
until I pack it up to rma ( have to cut the plastic retainers and replace
them with new ones, too tight to remove/replace from above). Haven't made
bios changes for at least 6 months, when I installed my SATA drive. No
power sags, surges or other mishaps that I know of, something might have
happened when I was away from it, but that will usually bring the pc down if
it's bad enough to affect it that way. Did clear cmos and check setting, I
left things stock, this isn't an overclockers board, just an entry level to
s939. May try re-loading xp, just a pita to re-load all software,
re-loading is a last resort. Not to mention the damn WGA bs.
Re: Strange problem
It's not at all uncommon for a revision to change from Dec
2005 to present, though less likely they'd update any
picture just to show a newer silkscreen.
If there is a newer bios available, try it.
Ok, did you clear CMOS/reset/load defaults?
You might also visit a motherboard oriented web forum in
search of fellow users of that board. Perhaps
That isn't revealing, a poor thermal contact will result in
chip getting hotter, heatsink not as hot. Even so, if the
fan isn't spinning incredibly slow, odds are it isn't
overheating unless they'd simply failed to apply thermal
compound at all. Even so, I'd probably pull off the
headsink anyway, probably lap it's base (they are often
rather crude, rough on the bottom), and put a very small
blob of good thermal compound on the center of the chip,
letting pressure spread it out.
If you can't find the fault, you might as well pull the
board out now, have it lying on a non-conductive surface
(not anti-static packaging) with all non-essential parts
pulled out already to test as a barebones config with only
integrated features (then disabling those for another test),
1 memory module, CPU, heatsink/fan, video.
You don't necessarily have to install every last thing, just
use another drive or partition on that one to do a testbed
installation with just the OS, applicable drivers per the
functions (like drive controller and audio, video, chipset
but maybe MS IDE driver instead of the chipset driver).
Only if that works properly would you then look at building
up that installation to a production state.
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