Do you have a question? Post it now! No Registration Necessary. Now with pictures!
September 1, 2006, 3:00 am
rate this thread
Researchers have built a tiny silicon-based device that can effectively
chill a surface, providing a novel, more effective way to cool
microchips. The new device, designed and fabricated by engineers at
Intel, the University of Washington in Seattle, and Belmont, MA-based
Kronos Advanced Technologies, uses ionized air and an electric field to
cool the surface.
Computers are heating up with each new generation of chips, as more and
more heat-producing transistors are crammed onto them. Indeed, experts
say that by the end of this decade, the classic cooling solution--using
metal heat sinks to draw heat away from chips, and a rotary fan to cool
the heat sinks and push the hot air out of computers--will no longer be