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December 6, 2009, 8:03 pm
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I have just unpacked my new AMD Athlon 64 x2 with AM2 socket, and ASUS
motherboard, but the Fan kit did not contain any heat transfer gunk.
The instructions no where refer to this being neaded, but I have been
using the stuff since my first 386.
Do I nead this, or not. The pamflet for the CPU says it contains lead,
so maybe I am thinking this is a substitute for the gunk.
Many thanks in advance,
Re: AMD SM3 Socket and heat transfer gunk (Thermal Interface Material)
On Sun, 6 Dec 2009 12:33:45 -0800 (PST), AaronNGray
Many do now pre-apply the thermal interface material. It
should work fine, but some will remove it and put grease on
instead. The advantage of the thermal pad is "supposedly"
it is applied uniformly and at the right thickness, and
should give good lifespan.
The advantage of cleaning it off and using a good quality
thermal grease is "if" properly applied it may reduce
temperatures a bit (usually only important for overclocking
or use of marginal heatsinks), and later if you want to
remove the heatsink a grease will allow easy removal while
many pre-applied thermal interface materials solidly *glue*
the heatsink on requiring a lot more effort to remove it,
often meaning running the system again to heat it up, or
applying heat to the'sink with another means like a
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